Please use this identifier to cite or link to this item:
https://repositori.mypolycc.edu.my/jspui/handle/123456789/9233| Title: | Ic Fabrication And Packaging Technology |
| Other Titles: | EE503 |
| Authors: | Jabatan Kejuruteraan Elektrik (JKE) |
| Keywords: | Introduction to IC Technology Semiconductor Materials IC Fabrication Process |
| Issue Date: | 7-Nov-2014 |
| Publisher: | Bahagian Peperiksaan Dan Penilaian, JPPKK |
| Description: | Kertas ini mengandungi TUJUH (7) halaman bercetak. Bahagian A: Struktur (10 soalan) Bahagian B: Esei (3 soalan) Dokumen sokongan yang disertakan: Tiada |
| URI: | https://repositori.mypolycc.edu.my/jspui/handle/123456789/9233 |
| Appears in Collections: | Exam Paper Collections |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| EE503 IC FABRICATION AND PACKAGING TECHNOLOGY.pdf | 747.1 kB | Adobe PDF |  View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.