Please use this identifier to cite or link to this item: https://repositori.mypolycc.edu.my/jspui/handle/123456789/9044
Title: INTEGRATED CIRCUIT FABRICATION PROCESS IC TESTING RELIABILITY FAILURE ANALYSIS
Authors: ZAHIT, ROSFAZLISZAH
YAHYA, AZLIN
HASHIMUDDIN, MOHD FARIS
Keywords: Semiconductor Fabrication
Wafer Processing
Issue Date: 2025
Publisher: POLITEKNIK MERLIMAU
Description: Integrated circuits (ICs) are at the core of today’s technology — powering smartphones, computers, and industrial systems. Understanding how ICs are tested, evaluated, and maintained for reliability is a key foundation for future engineers and technologists. This eBook, “IC Testing, Reliability and Failure Analysis,” is part of the Integrated Circuit Fabrication Process learning series. It introduces students to essential post-fabrication concepts including IC testing, reliability prediction, degradation behavior, and failure analysis. To enhance understanding, this eBook integrates interactive learning elements such as videos for visual demonstration, quizzes for self- assessment, and illustrations to support conceptual clarity. These features aim to make learning more engaging, dynamic, and aligned with real-world semiconductor practices.
URI: https://repositori.mypolycc.edu.my/jspui/handle/123456789/9044
Appears in Collections:INTEGRATED CIRCUIT FABRICATION PROCESS IC TESTING RELIABILITY FAILURE ANALYSIS

Files in This Item:
File Description SizeFormat 
INTEGRATED CIRCUIT FABRICATION PROCESS IC TESTING RELIABILITY FAILURE ANALYSIS FULL.pdf39.67 MBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.