Sila gunakan pengecam ini untuk memetik atau memaut ke item ini:
https://repositori.mypolycc.edu.my/jspui/handle/123456789/9044| Tajuk: | INTEGRATED CIRCUIT FABRICATION PROCESS IC TESTING RELIABILITY FAILURE ANALYSIS |
| Pengarang: | ZAHIT, ROSFAZLISZAH YAHYA, AZLIN HASHIMUDDIN, MOHD FARIS |
| Kata kunci: | Semiconductor Fabrication Wafer Processing |
| Tarikh diterbit: | 2025 |
| Penerbit: | POLITEKNIK MERLIMAU |
| Penerangan: | Integrated circuits (ICs) are at the core of today’s technology — powering smartphones, computers, and industrial systems. Understanding how ICs are tested, evaluated, and maintained for reliability is a key foundation for future engineers and technologists. This eBook, “IC Testing, Reliability and Failure Analysis,” is part of the Integrated Circuit Fabrication Process learning series. It introduces students to essential post-fabrication concepts including IC testing, reliability prediction, degradation behavior, and failure analysis. To enhance understanding, this eBook integrates interactive learning elements such as videos for visual demonstration, quizzes for self- assessment, and illustrations to support conceptual clarity. These features aim to make learning more engaging, dynamic, and aligned with real-world semiconductor practices. |
| URI: | https://repositori.mypolycc.edu.my/jspui/handle/123456789/9044 |
| Muncul dalam Koleksi: | INTEGRATED CIRCUIT FABRICATION PROCESS IC TESTING RELIABILITY FAILURE ANALYSIS |
| Fail | Penerangan | Saiz | Format | |
|---|---|---|---|---|
| INTEGRATED CIRCUIT FABRICATION PROCESS IC TESTING RELIABILITY FAILURE ANALYSIS FULL.pdf | 39.67 MB | Adobe PDF | Lihat/buka |
Item di DSpace dilindungi oleh hak cipta, dengan semua hak dilindungi, kecuali dinyatakan sebaliknya.