
Please use this identifier to cite or link to this item:
https://repositori.mypolycc.edu.my/jspui/handle/123456789/9227Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jabatan Kejuruteraan Elektrik (JKE) | - |
| dc.date.accessioned | 2026-04-09T02:37:25Z | - |
| dc.date.available | 2026-04-09T02:37:25Z | - |
| dc.date.issued | 2014-04-16 | - |
| dc.identifier.uri | https://repositori.mypolycc.edu.my/jspui/handle/123456789/9227 | - |
| dc.description | Kertas ini mengandungi TUJUH(7) halaman bercetak. Bahagian A: Struktur (10 soalan) Bahagian B: Esei (3 soalan) Dokumen sokongan yang disertakan: Tiada | ms_IN |
| dc.language.iso | en | ms_IN |
| dc.publisher | Bahagian Peperiksaan Dan Penilaian, JPPKK | ms_IN |
| dc.subject | Introduction to IC Technology | ms_IN |
| dc.subject | Semiconductor Materials | ms_IN |
| dc.subject | IC Fabrication Process | ms_IN |
| dc.title | Ic Fabrication And Packaging Technology | ms_IN |
| dc.title.alternative | EE503 | ms_IN |
| Appears in Collections: | Exam Paper Collections | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| EE503-_IC FABRICATION AND PACKAGING TECHNOLOGY-16 APR 2014.pdf | 3.23 MB | Adobe PDF | ![]() View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
