Please use this identifier to cite or link to this item:
https://repositori.mypolycc.edu.my/jspui/handle/123456789/6839
Title: | ANALYSIS OF LATENT DEFECT DETECTION USING SIGMA DEVIATION COUNT LABELING (SDCL) |
Authors: | Koo, Yun-su Shin, Woo-chang Park, Ha-je Yang, Hee-yeong Nam, Choon-sung |
Keywords: | SDCL Latent defect Machine learning Semiconductor Post process prediction |
Issue Date: | 1-Oct-2025 |
Publisher: | MDPI |
Series/Report no.: | Electronics;2025, 14, 3912 |
Abstract: | To maintain product reliability and stabilize performance, it is essential to prioritize the identification and resolution of latent defects. Advanced products such as high-precision electronic devices and semiconductors are susceptible to performance degradation over time due to environmental factors and electrical stress. However, conventional performance testing methods typically evaluate products based solely on predefined acceptable ranges, making it difficult to predict long-term degradation, even for products that pass initial testing. In particular, products exhibiting borderline values close to the threshold during initial inspections are at a higher risk of exceeding permissible limits as time progresses. Therefore, to ensure long-term product stability and quality, a novel approach is required that enables the early prediction of potential defects based on test data. In this context, the present study proposes a machine learning-based framework for predicting latent defects in products that are initially classified as normal. Specifically, we introduce the Sigma Deviation Count Labeling (SDCL) method, which utilizes a Gaussian distribution-based approach. This method involves preprocessing the dataset consisting of initially passed test samples by removing redundant features and handling missing values, thereby con structing a more robust input for defect prediction models. Subsequently, outlier counting and labeling are performed based on statistical thresholds defined by 2σ and 3σ, which represent potential anomalies outside the critical boundaries. This process enables the identification of statistically significant outliers, which are then used for training machine learning models. The experiments were conducted using two distinct datasets. Although both datasets share fundamental information such as time, user data, and temperature, they differ in the specific characteristics of the test parameters. By utilizing these two distinct test datasets, the proposed method aims to validate its general applicability as a Predictive Anomaly Testing (PAT) approach. Experimental results demonstrate that most models achieved high accuracy and geometric mean (GM) at the 3σ level, with maximum values of 1.0 for both metrics. Among the tested models, the Support Vector Machine (SVM) exhibited the most stable classification performance. Moreover, the consistency of results across different models further supports the robustness of the proposed method. These findings suggest that the SDCL-based PAT approach is not only stable but also highly adaptable across various datasets and testing environments. Ultimately, the proposed framework offers a promising solution for enhancing product quality and reliability by enabling the early detection and prevention of latent defects. |
URI: | https://repositori.mypolycc.edu.my/jspui/handle/123456789/6839 |
Appears in Collections: | JABATAN KEJURUTERAAN ELEKTRIK |
Files in This Item:
File | Description | Size | Format | |
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Analysis of Latent Defect Detection Using Sigma Deviation.pdf | 712.46 kB | Adobe PDF | ![]() View/Open |
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